Liquid Crystalline Polymer Composition

ABSTRACT

A compact camera module that contains a generally planar base on which is mounted a lens barrel is provided. The base, barrel, or both are molded from a polymer composition that includes a thermotropic liquid crystalline polymer and a plurality of mineral fibers (also known as “whisker”). The mineral fibers have a median width of from about 1 to about 35 micrometers and constitute from about 5 wt % to about 60 wt % of the polymer composition.

RELATED APPLICATIONS

The present application claims priority to U.S. Provisional ApplicationSer. No. 61/779,260, filed on Mar. 13, 2013, which is incorporatedherein in its entirety by reference thereto.

BACKGROUND OF THE INVENTION

Compact camera modules (“CCM”) are often employed in mobile phones,laptop computers, digital cameras, digital video cameras, etc. thatcontain a plastic lens barrel disposed on a base. Because conventionalplastic lenses could not withstand solder reflow, camera modules werenot typically surface mounted. Recently, however, attempts have beenmade to use liquid crystalline polymers having a high heat resistancefor the molded parts of a compact camera module, such as the lens barrelor the base on which it is mounted. To improve the mechanical propertiesof such polymers, it is known to add a plate-like substance (e.g., talc)and milled glass. Although strength and elastic modulus can be improvedin this manner, problems are still encountered when attempting to usesuch materials in compact camera modules due to their small dimensionaltolerance. For example, the mechanical properties are often poor or notuniform, which leads to poor filing and a lack of dimensional stabilityin the molded part. Further, an increase in the amount of milled glassto improve mechanical properties can result in a surface that is toorough, which can lead to errors in the camera performance and sometimescause unwanted particle generation.

As such, a need exists for a polymer composition that can be readilyemployed in the molded parts of compact camera modules, and yet stillachieve good mechanical properties.

SUMMARY OF THE INVENTION

In accordance with one embodiment of the present invention, a polymercomposition is disclosed that comprises a functional aromatic compoundand plurality of mineral fibers embedded within a thermotropic liquidcrystalline polymer matrix. The mineral fibers have a median width offrom about 1 to about 35 micrometers and constitute from about 5 wt % toabout 60 wt. % of the polymer composition.

Other features and aspects of the present invention are set forth ingreater detail below.

BRIG DESCRIPTION OF THE FIGURES

A full and enabling disclosure of the present invention, including thebest mode thereof to one skilled in the art, is set forth moreparticularly in the remainder of the specification, including referenceto the accompanying figures, in which:

FIG. 1 is an exploded perspective view of one embodiment of a fine pitchelectrical connector that may be formed according to the presentinvention;

FIG. 2 is a front view of opposing walls of the fine pitch electricalconnector of FIG. 1;

FIG. 3 is a schematic illustration of one embodiment of an extruderscrew that may be used to form the polymer composition of the presentinvention;

FIGS. 4-5 are respective front and rear perspective views of anelectronic component that can employ an antenna structure formed inaccordance with one embodiment of the present invention; and

FIGS. 6-7 are perspective and front views of a compact camera module(“CCM”) that may be formed in accordance with one embodiment of thepresent invention

DETAILED DESCRIPTION

“Alkyl” refers to monovalent saturated aliphatic hydrocarbyl groupshaving from 1 to 10 carbon atoms and, in some embodiments, from 1 to 6carbon atoms. “C_(x-y)alkyl” refers to alkyl groups having from x to ycarbon atoms. This term includes, by way of example, linear and branchedhydrocarbyl groups such as methyl (CH₃), ethyl (CH₃CH₂), n-propyl(CH₃CH₂CH₂), isopropyl ((CH₃)₂CH), n-butyl (CH₃CH₂CH2CH₂), isobutyl((CH₃)₂CHCH₂), sec-butyl ((CH₃)(CH₃CH₂)CH), t-butyl ((CH₃)₃C), n-pentyl(CH₃CH₂CH₂CH₂CH₂), and neopentyl ((CH₃)₃CCH₂).

“Alkoxy” refers to the group —O-alkyl. Alkoxy includes, by way ofexample, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, t-butoxy,sec-butoxy, and n-pentoxy.

“Alkenyl” refers to a linear or branched hydrocarbyl group having from 2to 10 carbon atoms and in some embodiments from 2 to 6 carbon atoms or 2to 4 carbon atoms and having at least 1 site of vinyl unsaturation(>C═C<). For example, (C_(x)-C_(y))alkenyl refers to alkenyl groupshaving from x to y carbon atoms and is meant to include for example,ethenyl, propenyl, 1,3-butadienyl, and so forth.

“Aryl” refers to an aromatic group of from 3 to 14 carbon atoms and noring heteroatoms and having a single ring (e.g., phenyl) or multiplecondensed (fused) rings (e.g., naphthyl or anthryl). For multiple ringsystems, including fused, bridged, and Spiro ring systems havingaromatic and non-aromatic rings that have no ring heteroatoms, the term“Aryl” applies when the point of attachment is at an aromatic carbonatom (e.g., 5,6,7,8 tetrahydronaphthalene-2-yl is an aryl group as itspoint of attachment is at the 2-position of the aromatic phenyl ring).

“Aryloxy” refers to the group —O-aryl, which includes, by way ofexample, phenoxy and naphthyloxy.

“Carboxyl” or “carboxy” refers to —COOH or salts thereof.

“Carboxyl ester” or “carboxy ester” refers to the groups —C(O)O-alkyl,C(O)O-alkenyl, C(O)O-aryl, C(O)O cycloalkyl, —C(O)O-heteroaryl, and—C(O)O-heterocyclic.

“Cycloalkyl” refers to a saturated or partially saturated cyclic groupof from 3 to 14 carbon atoms and no ring heteroatoms and having a singlering or multiple rings including fused, bridged, and Spiro ring systems.For multiple ring systems having aromatic and non-aromatic rings thathave no ring heteroatoms, the term “cycloalkyl” applies when the pointof attachment is at a non-aromatic carbon atom (e.g.,5,6,7,8,-tetrahydronaphthalene-5-yl). The term “cycloalkyl” includescycloalkenyl groups, such as adamantyl, cyclopropyl, cyclobutyl,cyclopentyl, cyclooctyl, and cyclohexenyl. The term “cycloalkenyl” issometimes employed to refer to a partially saturated cycloalkyl ringhaving at least one site of >C═C<ring unsaturation.

“Cycloalkyloxy” refers to —O cycloalkyl.

“Halo” or “halogen” refers to fluoro, chloro, bromo, and iodo.

“Haloalkyl” refers to substitution of alkyl groups with 1 to 5 or insome embodiments 1 to 3 halo groups.

“Heteroaryl” refers to an aromatic group of from 1 to 14 carbon atomsand 1 to 6 heteroatoms selected from oxygen, nitrogen, and sulfur andincludes single ring (e.g., imidazolyl) and multiple ring systems (e.g.,benzimidazol-2-yl and benzimidazol-6-yl). For multiple ring systems,including fused, bridged, and Spiro ring systems having aromatic andnon-aromatic rings, the term “heteroaryl” applies if there is at leastone ring heteroatom and the point of attachment is at an atom of anaromatic ring (e.g., 1,2,3,4-tetrahydroquinolin-6-yl and5,6,7,8-tetrahydroquinolin-3-yl). In some embodiments, the nitrogenand/or the sulfur ring atom(s) of the heteroaryl group are optionallyoxidized to provide for the N oxide (N→O), sulfinyl, or sulfonylmoieties. Examples of heteroaryl groups include, but are not limited to,pyridyl, furanyl, thienyl, thiazolyl, isothiazolyl, triazolyl,imidazolyl, imidazolinyl, isoxazolyl, pyrrolyl, pyrazolyl, pyridazinyl,pyrimidinyl, purinyl, phthalazyl, naphthylpryidyl, benzofuranyl,tetrahydrobenzofuranyl, isobenzofuranyl, benzothiazolyl,benzoisothiazolyl, benzotriazolyl, indolyl, isoindolyl, indolizinyl,dihydroindolyl, indazolyl, indolinyl, benzoxazolyl, quinolyl,isoquinolyl, quinolizyl, quianazolyl, quinoxalyl, tetrahydroquinolinyl,isoquinolyl, quinazolinonyl, benzimidazolyl, benzisoxazolyl,benzothienyl, benzopyridazinyl, pteridinyl, carbazolyl, carbolinyl,phenanthridinyl, acridinyl, phenanthrolinyl, phenazinyl, phenoxazinyl,phenothiazinyl, and phthalimidyl.

“Heteroaryloxy” refers to —O-heteroaryl.

“Heterocyclic” or “heterocycle” or “heterocycloalkyl” or “heterocyclyl”refers to a saturated or partially saturated cyclic group having from 1to 14 carbon atoms and from 1 to 6 heteroatoms selected from nitrogen,sulfur, or oxygen and includes single ring and multiple ring systemsincluding fused, bridged, and Spiro ring systems. For multiple ringsystems having aromatic and/or non-aromatic rings, the terms“heterocyclic”, “heterocycle”, “heterocycloalkyl”, or “heterocyclyl”apply when there is at least one ring heteroatom and the point ofattachment is at an atom of a non-aromatic ring (e.g.,decahydroquinolin-6-yl). In some embodiments, the nitrogen and/or sulfuratom(s) of the heterocyclic group are optionally oxidized to provide forthe N oxide, sulfinyl, sulfonyl moieties. Examples of heterocyclylgroups include, but are not limited to, azetidinyl, tetrahydropyranyl,piperidinyl, N-methylpiperidin-3-yl, piperazinyl,N-methylpyrrolidin-3-yl, 3-pyrrolidinyl, 2-pyrrolidon-1-yl, morpholinyl,thiomorpholinyl, imidazolidinyl, and pyrrolidinyl.

“Heterocyclyloxy” refers to the group —O-heterocycyl.

“Acyl” refers to the groups H—C(O)—, alkyl-C(O)—, alkenyl-C(O)—,cycloalkyl-C(O)—, aryl-C(O)—, heteroaryl-C(O)—, and heterocyclic-C(O)—.Acyl includes the “acetyl” group CH₃C(O)—.

“Acyloxy” refers to the groups alkyl-C(O)O—, alkenyl-C(O)O—,aryl-C(O)O—, cycloalkyl-C(O)O—, heteroaryl-C(O)O—, andheterocyclic-C(O)O—. Acyloxy includes the “acetyloxy” group CH₃C(O)O—.

“Acylamino” refers to the groups —NHC(O)alkyl, —NHC(O)alkenyl,—NHC(O)cycloalkyl, —NHC(O)aryl, —NHC(O)heteroaryl, and—NHC(O)heterocyclic. Acylamino includes the “acetylamino” group—NHC(O)CH₃.

It should be understood that the aforementioned definitions encompassunsubstituted groups, as well as groups substituted with one or moreother functional groups as is known in the art. For example, an aryl,heteroaryl, cycloalkyl, or heterocyclyl group may be substituted withfrom 1 to 8, in some embodiments from 1 to 5, in some embodiments from 1to 3, and in some embodiments, from 1 to 2 substituents selected fromalkyl, alkenyl, alkynyl, alkoxy, acyl, acylamino, acyloxy, amino,quaternary amino, amide, imino, amidino, aminocarbonylamino,amidinocarbonylamino, aminothiocarbonyl, aminocarbonylamino,aminothiocarbonylamino, aminocarbonyloxy, aminosulfonyl,aminosulfonyloxy, aminosulfonylamino, aryl, aryloxy, arylthio, azido,carboxyl, carboxyl ester, (carboxyl ester)amino, (carboxyl ester)oxy,cyano, cycloalkyl, cycloalkyloxy, cycloalkylthio, guanidino, halo,haloalkyl, haloalkoxy, hydroxy, hydroxyamino, alkoxyamino, hydrazine,heteroaryl, heteroaryloxy, heteroarylthio, heterocyclyl,heterocyclyloxy, heterocyclylthio, nitro, oxo, thione, phosphate,phosphonate, phosphinate, phosphonamidate, phosphorodiamidate,phosphoramidate monoester, cyclic phosphoramidate, cyclicphosphorodiamidate, phosphoramidate diester, sulfate, sulfonate,sulfonyl, substituted sulfonyl, sulfonyloxy, thioacyl, thiocyanate,thiol, alkylthio, etc., as well as combinations of such substituents.

It is to be understood by one of ordinary skill in the art that thepresent discussion is a description of exemplary embodiments only, andis not intended as limiting the broader aspects of the presentinvention.

Generally speaking, the present invention is directed to a polymercomposition that contains a functional aromatic compound and a pluralityof mineral fibers (also known as “whiskers”) distributed within a liquidcrystalline polymer matrix. Notably, the present inventors havediscovered that such a composition can achieve a low melt viscositywithout sacrificing the mechanical properties of the composition.Without intending to be limited by theory, it is believed that thearomatic functional compound can react with the polymer chain to shortenits length and thus reduce melt viscosity. As a result of the presentinvention, the melt viscosity of the polymer composition is generallylow enough so that it can readily flow into the cavity of a mold havingsmall dimensions. For example, in one particular embodiment, the polymercomposition may have a melt viscosity of from about 0.5 to about 100Pa-s, in some embodiments from about 1 to about 80 Pa-s, and in someembodiments, from about 5 to about 50 Pa-s. Melt viscosity may bedetermined in accordance with ISO Test No. 11443 at a shear rate of 1000sec⁻¹ and temperature that is 15° C. above the melting temperature ofthe composition (e.g., 350° C.).

Conventionally, it was believed that polymer compositions having such alow viscosity would not also possess sufficiently good thermal andmechanical properties, or a smooth enough surface to enable their use incertain types of applications. Contrary to conventional thought,however, the polymer composition of the present invention has been foundto possess both excellent thermal and mechanical properties. This is duein part to the use of mineral fibers of a certain nature, size, andrelative concentration. Examples of such mineral fibers include, forinstance, those that are derived from silicates, such as neosilicates,sorosilicates, inosilicates (e.g., calcium inosilicates, such aswollastonite; calcium magnesium inosilicates, such as tremolite; calciummagnesium iron inosilicates, such as actinolite; magnesium ironinosilicates, such as anthophyllite; etc.), phyllosilicates (e.g.,aluminum phyllosilicates, such as palygorskite), tectosilicates, etc.;sulfates, such as calcium sulfates (e.g., dehydrated or anhydrousgypsum); mineral wools (e.g., rock or slag wool); and so forth.Particularly suitable are inosilicates, such as wollastonite fibersavailable from Nyco Minerals under the trade designation NYGLOS® (e.g.,NYGLOS® 4W or NYGLOS® 8).

The mineral fibers may have a median width (e.g., diameter) of fromabout 1 to about 35 micrometers, in some embodiments from about 2 toabout 20 micrometers, in some embodiments from about 3 to about 15micrometers, and in some embodiments, from about 7 to about 12micrometers. The mineral fibers may also have a narrow sizedistribution. That is, at least about 60% by volume of the fibers, insome embodiments at least about 70% by volume of the fibers, and in someembodiments, at least about 80% by volume of the fibers may have a sizewithin the ranges noted above. Without intending to be limited bytheory, it is believed that mineral fibers having the sizecharacteristics noted above can more readily move through moldingequipment, which enhances the distribution within the polymer matrix andminimizes the creation of surface defects. In addition to possessing thesize characteristics noted above, the mineral fibers may also have arelatively high aspect ratio (average length divided by median width) tohelp further improve the mechanical properties and surface quality ofthe resulting polymer composition. For example, the mineral fibers mayhave an aspect ratio of from about 1 to about 50, in some embodimentsfrom about 2 to about 20, and in some embodiments, from about 4 to about15. The volume average length of such mineral fibers may, for example,range from about 1 to about 200 micrometers, in some embodiments fromabout 2 to about 150 micrometers, in some embodiments from about 5 toabout 100 micrometers, and in some embodiments, from about 10 to about50 micrometers.

The relative amount of such mineral fibers may be selectively controlledto help achieve the desired mechanical properties without adverselyimpacting other properties of the composition, such as its smoothnesswhen formed into a molded part. For example, mineral fibers typicallyconstitute from about 5 wt. % to about 60 wt. %, in some embodimentsfrom about 10 wt. % to about 50 wt. %, and in some embodiments, fromabout 20 wt. % to about 40 wt. % of the polymer composition. Likewise,functional aromatic compounds typically constitute from about 0.001 wt.% to about 5 wt. %, in some embodiments from about 0.01 wt. % to about 1wt. %, and in some embodiments, from about 0.05 wt. % to about 0.5 wt. %of the polymer composition. While the concentration of the liquidcrystalline polymers may generally vary based on the presence of otheroptional components, they are typically present in an amount of fromabout 25 wt. % to about 95 wt. %, in some embodiments from about 30 wt.% to about 80 wt. %, and in some embodiments, from about 40 wt. % toabout 70 wt. %.

Various embodiments of the present invention will now be described inmore detail.

I. Liquid Crystalline Polymer

The thermotropic liquid crystalline polymer generally has a high degreeof crystallinity that enables it to effectively fill the small spaces ofa mold. Suitable thermotropic liquid crystalline polymers may includearomatic polyesters, aromatic poly(esteramides), aromaticpoly(estercarbonates), aromatic polyamides, etc., and may likewisecontain repeating units formed from one or more aromatichydroxycarboxylic acids, aromatic dicarboxylic acids, aromatic diols,aromatic aminocarboxylic acids, aromatic amines, aromatic diamines,etc., as well as combinations thereof.

Liquid crystalline polymers are generally classified as “thermotropic”to the extent that they can possess a rod-like structure and exhibit acrystalline behavior in its molten state (e.g., thermotropic nematicstate). Such polymers may be formed from one or more types of repeatingunits as is known in the art. The liquid crystalline polymer may, forexample, contain one or more aromatic ester repeating units, typicallyin an amount of from about 60 mol. % to about 99.9 mol. %, in someembodiments from about 70 mol. % to about 99.5 mol. %, and in someembodiments, from about 80 mol. % to about 99 mol. % of the polymer. Thearomatic ester repeating units may be generally represented by thefollowing Formula (V):

wherein,

ring B is a substituted or unsubstituted 6-membered aryl group (e.g.,1,4-phenylene or 1,3-phenylene), a substituted or unsubstituted6-membered aryl group fused to a substituted or unsubstituted 5- or6-membered aryl group (e.g., 2,6-naphthalene), or a substituted orunsubstituted 6-membered aryl group linked to a substituted orunsubstituted 5- or 6-membered aryl group (e.g., 4,4-biphenylene); and

Y₁ and Y₂ are independently O, C(O), NH, C(O)HN, or NHC(O).

Typically, at least one of Y₁ and Y₂ are C(O). Examples of such aromaticester repeating units may include, for instance, aromatic dicarboxylicrepeating units (Y₁ and Y₂ in Formula V are C(O)), aromatichydroxycarboxylic repeating units (Y₁ is O and Y₂ is C(O) in Formula V),as well as various combinations thereof.

Aromatic dicarboxylic repeating units, for instance, may be employedthat are derived from aromatic dicarboxylic acids, such as terephthalicacid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, diphenylether-4,4′-dicarboxylic acid, 1,6-naphthalenedicarboxylic acid,2,7-naphthalenedicarboxylic acid, 4,4′-dicarboxybiphenyl,bis(4-carboxyphenyl)ether, bis(4-carboxyphenyl)butane,bis(4-carboxyphenyl)ethane, bis(3-carboxyphenyl)ether,bis(3-carboxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryl andhalogen substituents thereof, and combinations thereof. Particularlysuitable aromatic dicarboxylic acids may include, for instance,terephthalic acid (“TA”), isophthalic acid (“IA”), and2,6-naphthalenedicarboxylic acid (“NDA”). When employed, repeating unitsderived from aromatic dicarboxylic acids (e.g., IA, TA, and/or NDA)typically constitute from about 5 mol. % to about 60 mol. %, in someembodiments from about 10 mol. % to about 55 mol. %, and in someembodiments, from about 15 mol. % to about 50% of the polymer.

Aromatic hydroxycarboxylic repeating units may also be employed that arederived from aromatic hydroxycarboxylic acids, such as, 4-hydroxybenzoicacid; 4-hydroxy-4′-biphenylcarboxylic acid: 2-hydroxy-6-naphthoic acid;2-hydroxy-5-naphthoic acid; 3-hydroxy-2-naphthoic acid;2-hydroxy-3-naphthoic acid; 4′-hydroxyphenyl-4-benzoic acid;3′-hydroxyphenyl-4-benzoic acid; 4′-hydroxyphenyl-3-benzoic acid, etc.,as well as alkyl, alkoxy, aryl and halogen substituents thereof, andcombination thereof. Particularly suitable aromatic hydroxycarboxylicacids are 4-hydroxybenzoic acid (“HBA”) and 6-hydroxy-2-naphthoic acid(“HNA”). When employed, repeating units derived from hydroxycarboxylicacids (e.g., HBA and/or HNA) typically constitute from about 10 mol. %to about 85 mol. %, in some embodiments from about 20 mol. % to about 80mol. %, and in some embodiments, from about 25 mol. % to about 75% ofthe polymer.

Other repeating units may also be employed in the polymer. In certainembodiments, for instance, repeating units may be employed that arederived from aromatic diols, such as hydroquinone, resorcinol,2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene,1,6-dihydroxynaphthalene, 4,4′-dihydroxybiphenyl (or 4,4′-biphenol),3,3′-dihydroxybiphenyl, 3,4′-dihydroxybiphenyl, 4,4′-dihydroxybiphenylether, bis(4-hydroxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryland halogen substituents thereof, and combinations thereof. Particularlysuitable aromatic diols may include, for instance, hydroquinone (“HQ”)and 4,4′-biphenol (“BP”). When employed, repeating units derived fromaromatic diols (e.g., HQ and/or BP) typically constitute from about 1mol. % to about 30 mol. %, in some embodiments from about 2 mol. % toabout 25 mol. %, and in some embodiments, from about 5 mol. % to about20% of the polymer. Repeating units may also be employed, such as thosederived from aromatic amides (e.g., acetaminophen (“APAP”)) and/oraromatic amines (e.g., 4-aminophenol (“AP”), 3-aminophenol,1,4-phenylenediamine, 1,3-phenylenediamine, etc.). When employed,repeating units derived from aromatic amides (e.g., APAP) and/oraromatic amines (e.g., AP) typically constitute from about 0.1 mol. % toabout 20 mol. %, in some embodiments from about 0.5 mol. % to about 15mol. %, and in some embodiments, from about 1 mol. % to about 10% of thepolymer. It should also be understood that various other monomericrepeating units may be incorporated into the polymer. For instance, incertain embodiments, the polymer may contain one or more repeating unitsderived from non-aromatic monomers, such as aliphatic or cycloaliphatichydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, etc.Of course, in other embodiments, the polymer may be “wholly aromatic” inthat it lacks repeating units derived from non-aromatic (e.g., aliphaticor cycloaliphatic) monomers.

Although not necessarily required, the liquid crystalline polymer may bea “naphthenic-rich” polymer to the extent that it contains a relativelyhigh content of repeating units derived from naphthenichydroxycarboxylic acids and naphthenic dicarboxylic acids, such asnaphthalene-2,6-dicarboxylic acid (“NDA”), 6-hydroxy-2-naphthoic acid(“HNA”), or combinations thereof. That is, the total amount of repeatingunits derived from naphthenic hydroxycarboxylic and/or dicarboxylicacids (e.g., NDA, HNA, or a combination of HNA and NDA) is typicallymore than about 10 mol. %, in some embodiments more than about 15 mol.%, and in some embodiments, from 18 mol. % to about 70 mol. % of thepolymer. In one particular embodiment, for example, a “naphthenic-rich”aromatic polyester may be formed that contains monomer repeat unitsderived from a naphthenic acid (e.g., NDA and/or HNA); 4-hydroxybenzoicacid (“HBA”), terephthalic acid (“TA”) and/or isophthalic acid (“IA”);as well as various other optional constituents. The monomer unitsderived from 4-hydroxybenzoic acid (“HBA”) may constitute from about 30mol. % to about 95 mol. %, in some embodiments from about 35 mol. % toabout 90 mol. %, and in some embodiments, from about 40 mol. % to about80 mol. % of the polymer, while the monomer units derived fromterephthalic acid (“TA”) and/or isophthalic acid (“IA”) may eachconstitute from about 1 mol. % to about 30 mol. %, in some embodimentsfrom about 2 mol. % to about 25 mol. %, and in some embodiments, fromabout 3 mol. % to about 20 mol. % of the polymer. Other possible monomerrepeat units include aromatic diols, such as 4,4′-biphenol (“BP”),hydroquinone (“HQ”), etc. and aromatic amides, such as acetaminophen(“APAP”). In certain embodiments, for example, BP, HQ, and/or APAP mayconstitute from about 1 mol. % to about 40 mol. %, in some embodimentsfrom about 10 mol. % to about 35 mol. %, and in some embodiments, fromabout 20 mol. % to about 30 mol. % when employed.

Regardless of the particular constituents and nature of the polymer, theliquid crystalline polymer may be prepared by initially introducing thearomatic monomer(s) used to form ester repeating units (e.g., aromatichydroxycarboxylic acid, aromatic dicarboxylic acid, etc.) and/or otherrepeating units (e.g., aromatic diol, aromatic amide, aromatic amine,etc.) into a reactor vessel to initiate a polycondensation reaction. Theparticular conditions and steps employed in such reactions are wellknown, and may be described in more detail in U.S. Pat. No. 4,161,470 toCalundann; U.S. Pat. No. 5,616,680 to Linstid, III, et al.; U.S. Pat.No. 6,114,492 to Linstid, III, et al.; U.S. Pat. No. 6,514,611 toShepherd, et al.; and WO 2004/058851 to Waggoner. The vessel employedfor the reaction is not especially limited, although it is typicallydesired to employ one that is commonly used in reactions of highviscosity fluids. Examples of such a reaction vessel may include astirring tank-type apparatus that has an agitator with a variably-shapedstirring blade, such as an anchor type, multistage type, spiral-ribbontype, screw shaft type, etc., or a modified shape thereof. Furtherexamples of such a reaction vessel may include a mixing apparatuscommonly used in resin kneading, such as a kneader, a roll mill, aBanbury mixer, etc.

If desired, the reaction may proceed through the acetylation of themonomers as known the art. This may be accomplished by adding anacetylating agent (e.g., acetic anhydride) to the monomers. Acetylationis generally initiated at temperatures of about 90° C. During theinitial stage of the acetylation, reflux may be employed to maintainvapor phase temperature below the point at which acetic acid byproductand anhydride begin to distill. Temperatures during acetylationtypically range from between 90° C. to 150° C., and in some embodiments,from about 110° C. to about 150° C. If reflux is used, the vapor phasetemperature typically exceeds the boiling point of acetic acid, butremains low enough to retain residual acetic anhydride. For example,acetic anhydride vaporizes at temperatures of about 140° C. Thus,providing the reactor with a vapor phase reflux at a temperature of fromabout 110° C. to about 130° C. is particularly desirable. To ensuresubstantially complete reaction, an excess amount of acetic anhydridemay be employed. The amount of excess anhydride will vary depending uponthe particular acetylation conditions employed, including the presenceor absence of reflux. The use of an excess of from about 1 to about 10mole percent of acetic anhydride, based on the total moles of reactanthydroxyl groups present is not uncommon.

Acetylation may occur in a separate reactor vessel, or it may occur insitu within the polymerization reactor vessel. When separate reactorvessels are employed, one or more of the monomers may be introduced tothe acetylation reactor and subsequently transferred to thepolymerization reactor. Likewise, one or more of the monomers may alsobe directly introduced to the reactor vessel without undergoingpre-acetylation.

In addition to the monomers and optional acetylating agents, othercomponents may also be included within the reaction mixture to helpfacilitate polymerization. For instance, a catalyst may be optionallyemployed, such as metal salt catalysts (e.g., magnesium acetate, tin(I)acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassiumacetate, etc.) and organic compound catalysts (e.g., N-methylimidazole).Such catalysts are typically used in amounts of from about 50 to about500 parts per million based on the total weight of the recurring unitprecursors. When separate reactors are employed, it is typically desiredto apply the catalyst to the acetylation reactor rather than thepolymerization reactor, although this is by no means a requirement.

The reaction mixture is generally heated to an elevated temperaturewithin the polymerization reactor vessel to initiate meltpolycondensation of the reactants. Polycondensation may occur, forinstance, within a temperature range of from about 250° C. to about 400°C., in some embodiments from about 280° C. to about 395° C., and in someembodiments, from about 300° C. to about 380° C. For instance, onesuitable technique for forming the liquid crystalline polymer mayinclude charging precursor monomers and acetic anhydride into thereactor, heating the mixture to a temperature of from about 90° C. toabout 150° C. to acetylize a hydroxyl group of the monomers (e.g.,forming acetoxy), and then increasing the temperature to from about 250°C. to about 400° C. to carry out melt polycondensation. As the finalpolymerization temperatures are approached, volatile byproducts of thereaction (e.g., acetic acid) may also be removed so that the desiredmolecular weight may be readily achieved. The reaction mixture isgenerally subjected to agitation during polymerization to ensure goodheat and mass transfer, and in turn, good material homogeneity. Therotational velocity of the agitator may vary during the course of thereaction, but typically ranges from about 10 to about 100 revolutionsper minute (“rpm”), and in some embodiments, from about 20 to about 80rpm. To build molecular weight in the melt, the polymerization reactionmay also be conducted under vacuum, the application of which facilitatesthe removal of volatiles formed during the final stages ofpolycondensation. The vacuum may be created by the application of asuctional pressure, such as within the range of from about 5 to about 30pounds per square inch (“psi”), and in some embodiments, from about 10to about 20 psi.

Following melt polymerization, the molten polymer may be discharged fromthe reactor, typically through an extrusion orifice fitted with a die ofdesired configuration, cooled, and collected. Commonly, the melt isdischarged through a perforated die to form strands that are taken up ina water bath, pelletized and dried. In some embodiments, the meltpolymerized polymer may also be subjected to a subsequent solid-statepolymerization method to further increase its molecular weight.Solid-state polymerization may be conducted in the presence of a gas(e.g., air, inert gas, etc.). Suitable inert gases may include, forinstance, include nitrogen, helium, argon, neon, krypton, xenon, etc.,as well as combinations thereof. The solid-state polymerization reactorvessel can be of virtually any design that will allow the polymer to bemaintained at the desired solid-state polymerization temperature for thedesired residence time. Examples of such vessels can be those that havea fixed bed, static bed, moving bed, fluidized bed, etc. The temperatureat which solid-state polymerization is performed may vary, but istypically within a range of from about 250° C. to about 350° C. Thepolymerization time will of course vary based on the temperature andtarget molecular weight. In most cases, however, the solid-statepolymerization time will be from about 2 to about 12 hours, and in someembodiments, from about 4 to about 10 hours.

II. Functional Aromatic Compound

As indicated above, the polymer composition of the present inventionalso contains a functional aromatic compound. Such compounds generallycontain one or more carboxyl and/or hydroxyl functional groups that canreact with the polymer chain to shorten its length as described above.In certain cases, the compound may also be able to combine smallerchains of the polymer together after they have been cut to help maintainthe mechanical properties of the composition even after its meltviscosity has been reduced. The functional compound typically has thegeneral structure provided below in Formula (I):

or a metal salt thereof, wherein,

ring B is a 6-membered aromatic ring wherein 1 to 3 ring carbon atomsare optionally replaced by nitrogen or oxygen, wherein each nitrogen isoptionally oxidized, and wherein ring B may be optionally fused orlinked to a 5- or 6-membered aryl, heteroaryl, cycloalkyl, orheterocyclyl;

R₄ is OH or COOH;

R₅ is acyl, acyloxy (e.g., acetyloxy), acylamino (e.g., acetylamino),alkoxy, alkenyl, alkyl, amino, aryl, aryloxy, carboxyl, carboxyl ester,cycloalkyl, cycloalkyloxy, hydroxyl, halo, haloalkyl, heteroaryl,heteroaryloxy, heterocyclyl, or heterocycloxy;

m is from 0 to 4, in some embodiments from 0 to 2, and in someembodiments, from 0 to 1; and

n is from 1 to 3, and in some embodiments, from 1 to 2. When thecompound is in the form of a metal salt, suitable metal counterions mayinclude transition metal counterions (e.g., copper, iron, etc.), alkalimetal counterions (e.g., potassium, sodium, etc.), alkaline earth metalcounterions (e.g., calcium, magnesium, etc.), and/or main group metalcounterions (e.g., aluminum).

In one embodiment, for example, B is phenyl in Formula (I) such that theresulting phenolic compounds have the following general formula (II):

or a metal salt thereof, wherein,

R₄ is OH or COOH,

R₆ is acyl, acyloxy, acylamino, alkoxy, alkenyl, alkyl, amino, carboxyl,carboxyl ester, hydroxyl, halo, or haloalkyl; and

q is from 0 to 4, in some embodiments from 0 to 2, and in someembodiments, from 0 to 1. Particular examples of such phenolic compoundsinclude, for instance, benzoic acid (q is 0); 4-hydroxybenzoic acid (R₄is COOH, R₆ is OH, and q is 1); phthalic acid (R₄ is COOH, R₆ is COOH,and q is 1); isophthalic acid (R₄ is COOH, R₆ is COOH, and q is 1);terephthalic acid (R₄ is COOH, R₆ is COOH, and q is 1);2-methylterephthalic acid (R₄ is COOH, R₆ is COOH, and CH₃ and q is 2);phenol (R₄ is OH and q is 0); sodium phenoxide (R₄ is OH and q is 0);hydroquinone (R₄ is OH, R₆ is OH, and q is 1); resorcinol (R₄ is OH, R₆is OH, and q is 1); 4-hydroxybenzoic acid (R₄ is OH, R₆ is C(O)OH, and qis 1), etc., as well as combinations thereof.

In another embodiment, B is phenyl and R₅ is phenyl in Formula (I) abovesuch that the diphenolic compounds have the following general formula(III):

or a metal salt thereof, wherein,

R₄ is COOH or OH;

R₆ is acyl, acyloxy, acylamino, alkoxy, alkenyl, alkyl, amino, aryl,aryloxy, carboxyl, carboxyl ester, cycloalkyl, cycloalkyloxy, hydroxyl,halo, haloalkyl, heteroaryl, heteroaryloxy, heterocyclyl, orheterocycloxy; and

q is from 0 to 4, in some embodiments from 0 to 2, and in someembodiments, from 0 to 1. Particular examples of such diphenoliccompounds include, for instance, 4-hydroxy-4′-biphenylcarboxylic acid(R₄ is COOH, R₆ is OH, and q is 1); 4′-hydroxyphenyl-4-benzoic acid (R₄is COOH, R₆ is OH, and q is 1); 3′-hydroxyphenyl-4-benzoic acid (R₄ isCOOH, R₆ is OH, and q is 1); 4′-hydroxyphenyl-3-benzoic acid (R₄ isCOOH, R₆ is OH, and q is 1); 4,4′-bibenzoic acid (R₄ is COOH, R₆ isCOOH, and q is 1); (R₄ is OH, R₆ is OH, and q is 1); 3,3′-biphenol (R₄is OH, R₆ is OH, and q is 1); 3,4′-biphenol (R₄ is OH. R₆ is OH, and qis 1); 4-phenylphenol (R₄ is OH and q is 0); bis(4-hydroxyphenyl)ethane(R₄ is OH, R₆ is C₂(OH)₂phenol, and q is 1); tris(4-hydroxyphenyl)ethane(R₄ is OH, R₆ is C(CH₃)biphenol, and q is 1);4-hydroxy-4′-biphenylcarboxylic acid (R₄ is OH, R₆ is COOH, and q is 1);4′-hydroxyphenyl-4-benzoic acid (R₄ is OH, R₆ is COOH, and q is 1);3′-hydroxyphenyl-4-benzoic acid (R₄ is OH, R₆ is COOH, and q is 1);4′-hydroxyphenyl-3-benzoic acid (R₄ is OH, R₆ is COOH, and q is 1);etc., as well as combinations thereof.

In yet another embodiment, B is naphthenyl in Formula (I) above suchthat the resulting naphthenic compounds have the following generalformula (IV):

or a metal salt thereof, wherein,

R₄ is OH or COOH;

R₆ is acyl, acyloxy, acylamino, alkoxy, alkenyl, alkyl, amino, aryl,aryloxy, carboxyl, carboxyl ester, cycloalkyl, cycloalkyloxy, hydroxyl,halo, haloalkyl, heteroaryl, heteroaryloxy, heterocyclyl, orheterocycloxy; and

q is from 0 to 4, in some embodiments from 0 to 2, and in someembodiments, from 0 to 1. Particular examples of such naphtheniccompounds include, for instance, 1-naphthoic acid (R₄ is COOH and q is0); 2-naphthoic acid (R₄ is COOH and q is 0); 2-hydroxy-6-naphthoic acid(R₄ is COOH, R₆ is OH, and q is 1); 2-hydroxy-5-naphthoic acid (R₄ isCOOH. R₆ is OH, and q is 1); 3-hydroxy-2-naphthoic acid (R₄ is COOH, R₆is OH, and q is 1); 2-hydroxy-3-naphthoic acid (R₄ is COOH, R₆ is OH,and q is 1); 2,6-naphthalenedicarboxylic acid (R₄ is COOH, R₆ is COOH,and q is 1); 2,3-naphthalenedicarboxylic acid (R₄ is COOH, R₆ is COOH,and q is 1); 2-hydroxy-naphthelene (R₄ is OH and q is 0);2-hydroxy-6-naphthoic acid (R₄ is OH, R₆ is COOH, and q is 1);2-hydroxy-5-naphthoic acid (R₄ is OH, R₆ is COOH, and q is 1);3-hydroxy-2-naphthoic acid (R₄ is OH, R₆ is COOH, and q is 1);2-hydroxy-3-naphthoic acid (R₄ is OH, R₆ is COOH, and q is 1);2,6-dihydroxynaphthalene (R₄ is OH, R₆ is OH, and q is 1);2,7-dihydroxynaphthalene (R₄ is OH, R₆ is OH, and q is 1);1,6-dihydroxynaphthalene (R₄ is OH, R₆ is OH, and q is 1), etc., as wellas combinations thereof.

In certain embodiments of the present invention, for example, thepolymer composition may contain an aromatic dial, such as hydroquinone,resorcinol, 4,4′-biphenol, etc., as well as combinations thereof. Whenemployed, such aromatic diols may constitute from about 0.01 wt. % toabout 1 wt. %, and in some embodiments, from about 0.05 wt. % to about0.4 wt. % of the polymer composition. An aromatic carboxylic acid mayalso be employed in certain embodiments, either alone or in conjunctionwith the aromatic diol. Aromatic carboxylic acids may constitute fromabout 0.001 wt. % to about 0.5 wt. %, and in some embodiments, fromabout 0.005 wt. % to about 0.1 wt. % of the polymer composition. Inparticular embodiments, a combination of an aromatic diol (R4 and R₆ areOH in the formulae above) (e.g., 4,4′-biphenol) and an aromaticdicarboxylic acid (R₄ and R₆ are COOH in the formulae above) (e.g.,2,6-naphthelene dicarboxylic acid) is employed in the present inventionto help achieve the desired flow properties.

III. Optional Components

A. Non-Aromatic Functional Compounds

In addition to those noted above, non-aromatic functional compounds mayalso be employed in the present invention. Such compounds may serve avariety of purposes, such as further assisting in the reduction of meltviscosity. One such non-aromatic functional compound is water. Ifdesired, water can be added in a form that under process conditionsgenerates water. For example, the water can be added as a hydrate thatunder the process conditions (e.g., high temperature) effectively“loses” water. Such hydrates include alumina trihydrate, copper sulfatepentahydrate, barium chloride dihydrate, calcium sulfate dehydrate,etc., as well as combinations thereof. When employed, the hydrates mayconstitute from about 0.02 wt. % to about 2 wt. %, and in someembodiments, from about 0.05 wt. % to about 1 wt. % of the polymercomposition. In one particular embodiment, a mixture of an aromaticdiol, hydrate, and aromatic dicarboxylic acid are employed in thecomposition. In such embodiments, the weight ratio of hydrates toaromatic dials is typically from about 0.5 to about 8, in someembodiments from about 0.8 to about 5, and in some embodiments, fromabout 1 to about 5.

B. Conductive Filler

If desired, a conductive filler may be employed in the polymercomposition to help reduce the tendency to create a static electriccharge during a molding operation. In fact, the present inventors havediscovered that the presence of a controlled size and amount of themineral fibers, as noted above, can enhance the ability of theconductive filler to be dispersed within the liquid crystalline polymermatrix, thereby allowing allow for the use of relatively lowconcentrations of the conductive filler to achieve the desiredantistatic properties. Because it is employed in relatively lowconcentrations, however, the impact on thermal and mechanical propertiescan be minimized. In this regard, conductive fillers, when employed,typically constitute from about 0.1 wt. % to about 25 wt. %, in someembodiments from about 0.3 wt. % to about 10 wt. %, in some embodimentsfrom about 0.4 wt. % to about 3 wt. %, and in some embodiments, fromabout 0.5 wt. % to about 1.5 wt. % of the polymer composition.

Any of a variety of conductive fillers may generally be employed in thepolymer composition to help improve its antistatic characteristics.Examples of suitable conductive fillers may include, for instance, metalparticles (e.g., aluminum flakes), metal fibers, carbon particles (e.g.,graphite, expanded graphite, grapheme, carbon black, graphitized carbonblack, etc.), carbon nanotubes, carbon fibers, and so forth. Carbonfibers and carbon particles (e.g., graphite) are particularly suitable.When employed, suitable carbon fibers may include pitch-based carbon(e.g., tar pitch), polyacrylonitrile-based carbon, metal-coated carbon,etc. Desirably, the carbon fibers have a high purity in that theypossess a relatively high carbon content, such as a carbon content ofabout 85 wt. % or more, in some embodiments about 90 wt. % or more, andin some embodiments, about 93 wt. % or more. For instance, the carboncontent can be at least about 94% wt., such as at least about 95% wt.,such as at least about 96% wt., such at least about 97% wt., such aseven at least about 98% wt. The carbon purity is generally less than 100wt. %, such as less than about 99 wt. %. The density of the carbonfibers is typically from about 0.5 to about 3.0 g/cm³, in someembodiments from about 1.0 to about 2.5 g/cm³, and in some embodiments,from about 1.5 to about 2.0 g/cm³.

In one embodiment, the carbon fibers are incorporated into the matrixwith minimal fiber breakage. The volume average length of the fibersafter molding can generally be from about 0.1 mm to about 1 mm even whenusing a fiber having an initial length of about 3 mm. The average lengthand distribution of the carbon fibers can also be selectively controlledin the final polymer composition to achieve a better connection andelectrical pathway within the liquid crystalline polymer matrix. Theaverage diameter of the fibers can be from about 0.5 to about 30micrometers, in some embodiments from about 1 to about 20 micrometers,and in some embodiments, from about 3 to about 15 micrometers.

To improve dispersion within the polymer matrix, the carbon fibers maybe at least partially coated with a sizing agent that increases thecompatibility of the carbon fibers with the liquid crystalline polymer.The sizing agent may be stable so that it does not thermally degrade attemperatures at which the liquid crystalline polymer is molded. In oneembodiment, the sizing agent may include a polymer, such as an aromaticpolymer. For instance, the aromatic polymer may have a thermaldecomposition temperature of greater than about 300° C., such as greaterthan about 350° C., such as greater than about 400° C. As used herein,the thermal decomposition temperature of a material is the temperatureat which the material losses 5% of its mass during thermogravimetricanalysis as determined in accordance with ASTM Test E 1131 (or ISO Test11358). The sizing agent can also have a relatively high glasstransition temperature. For instance, the glass transition temperatureof the sizing agent can be greater than about 300° C., such as greaterthan about 350° C., such as greater than about 400° C. Particularexamples of sizing agents include polyimide polymers, aromatic polyesterpolymers including wholly aromatic polyester polymers, and hightemperature epoxy polymers. In one embodiment, the sizing agent mayinclude a liquid crystalline polymer. The sizing agent can be present onthe fibers in an amount of at least about 0.1% wt., such as in an amountof at least 0.2% wt., such as in an amount of at least about 0.1% wt.The sizing agent is generally present in an amount less than about 5%wt., such as in an amount of less than about 3% wt,

Another suitable conductive filler is an ionic liquid. One benefit ofsuch a material is that, in addition to being electrically conductive,the ionic liquid can also exist in liquid form during melt processing,which allows it to be more uniformly blended within the liquidcrystalline polymer matrix. This improves electrical connectivity andthereby enhances the ability of the composition to rapidly dissipatestatic electric charges from its surface.

The ionic liquid is generally a salt that has a low enough meltingtemperature so that it can be in the form of a liquid when meltprocessed with the liquid crystalline polymer. For example, the meltingtemperature of the ionic liquid may be about 400° C. or less, in someembodiments about 350° C. or less, in some embodiments from about 1° C.to about 100° C., and in some embodiments, from about 5° C. to about 50°C. The salt contains a cationic species and counterion. The cationicspecies contains a compound having at least one heteroatom (e.g.,nitrogen or phosphorous) as a “cationic center.” Examples of suchheteroatomic compounds include, for instance, quaternary oniums havingthe following structures:

wherein, R¹, R², R³, R⁴, R⁵, R⁶, R⁷, and R⁸ are independently selectedfrom the group consisting of hydrogen; substituted or unsubstitutedC₁-C₁₀ alkyl groups (e.g., methyl, ethyl, n-propyl, isopropyl, n-butyl,isobutyl, sec-butyl, tert-butyl, n-pentyl, etc.); substituted orunsubstituted C₃-C₁₄ cycloalkyl groups (e.g., adamantyl, cyclopropyl,cyclobutyl, cyclopentyl, cyclooctyl, cyclohexenyl, etc.); substituted orunsubstituted C₁-C₁₀ alkenyl groups (e.g., ethylene, propylene,2-methypropylene, pentylene, etc.); substituted or unsubstituted C₂-C₁₀alkynyl groups (e.g., ethynyl, propynyl, etc.); substituted orunsubstituted C₁-C₁₀ alkoxy groups (e.g., methoxy, ethoxy, n-propoxy,isopropoxy, n-butoxy, t-butoxy, sec-butoxy, n-pentoxy, etc.);substituted or unsubstituted acyloxy groups (e.g., methacryloxy,methacryloxyethyl, etc.); substituted or unsubstituted aryl groups(e.g., phenyl); substituted or unsubstituted heteroaryl groups (e.g.,pyridyl, furanyl, thienyl, thiazolyl, isothiazolyl, triazolyl,imidazolyl, isoxazolyl, pyrrolyl, pyrazolyl, pyridazinyl, pyrimidinyl,quinolyl, etc.); and so forth. In one particular embodiment, forexample, the cationic species may be an ammonium compound having thestructure N⁺R¹R²R³R⁴, wherein R¹, R², and/or R³ are independently aC₁-C₆ alkyl (e.g., methyl, ethyl, butyl, etc.) and R⁴ is hydrogen or aC₁-C₄ alkyl group (e.g., methyl or ethyl). For example, the cationiccomponent may be tri-butylmethylammonium, wherein R¹, R², and R³ arebutyl and R⁴ is methyl.

Suitable counterions for the cationic species may include, for example,halogens (e.g., chloride, bromide, iodide, etc.); sulfates or sulfonates(e.g., methyl sulfate, ethyl sulfate, butyl sulfate, hexyl sulfate,octyl sulfate, hydrogen sulfate, methane sulfonate, dodecylbenzenesulfonate, dodecylsulfate, trifluoromethane sulfonate,heptadecafluorooctanesulfonate, sodium dodecylethoxysulfate, etc.);sulfosuccinates; amides (e.g., dicyanamide); imides (e.g.,bis(pentafluoroethyl-sulfonyl)imide, bis(trifluoromethylsulfonyl)imide,bis(trifluoromethyl)imide, etc.); borates (e.g., tetrafluoroborate,tetracyanoborate, bis[oxalato]borate, bis[salicylato]borate, etc.);phosphates or phosphinates (e.g., hexafluorophosphate, diethylphosphate,bis(pentafluoroethyl)phosphinate,tris(pentafluoroethyl)-trifluorophosphate,tris(nonafluorobutyl)trifluorophosphate, etc.); antimonates (e.g.,hexafluoroantimonate); aluminates (e.g., tetrachloroaluminate); fattyacid carboxylates (e.g., oleate, isostearate, pentadecafluorooctanoate,etc.); cyanates; acetates; and so forth, as well as combinations of anyof the foregoing. To help improve compatibility with the liquidcrystalline polymer, it may be desired to select a counterion that isgenerally hydrophobic in nature, such as imides, fatty acidcarboxylates, etc. Particularly suitable hydrophobic counterions mayinclude, for instance, bis(pentafluoroethylsulfonyl)imide,bis(trifluoromethylsulfonyl)imide, and bis(trifluoromethyl)imide.

In certain embodiments, a synergistic affect may be achieved by usingthe ionic liquid and a carbon filler (e.g., graphite, carbon fibers,etc.) in combination. Without intending to be limited by theory, thepresent inventor believes that the ionic liquid is able to readily flowduring melt processing to help provide a better connection andelectrical pathway between the carbon filler and the liquid crystallinepolymer matrix, thereby further reducing surface resistivity.

C. Glass Fillers

Glass fillers, which are not generally conductive, may also be employedin the polymer composition to help improve strength. For example, glassfillers may constitute from about 2 wt. % to about 40 wt. %, in someembodiments from about 5 wt. % to about 35 wt. %, and in someembodiments, from about 6 wt. % to about 30 wt. % of the polymercomposition. Glass fibers are particularly suitable for use in thepresent invention, such as those formed from E-glass, A-glass, C-glass,D-glass, AR-glass, R-glass, S1-glass, S2-glass, etc., as well asmixtures thereof. The median width of the glass fibers may be relativelysmall, such as from about 1 to about 35 micrometers, in some embodimentsfrom about 2 to about 20 micrometers, and in some embodiments, fromabout 3 to about 10 micrometers. When employed, it is believed that thesmall diameter of such glass fibers can allow their length to be morereadily reduced during melt blending, which can further improve surfaceappearance and mechanical properties. In the molded part, for example,the volume average length of the glass fibers may be relatively small,such as from about 10 to about 500 micrometers, in some embodiments fromabout 100 to about 400 micrometers, in some embodiments from about 150to about 350 micrometers, and in some embodiments, from about 200 toabout 325 micrometers. The glass fibers may also have a relatively highaspect ratio (average length divided by nominal diameter), such as fromabout 1 to about 100, in some embodiments from about 10 to about 60, andin some embodiments, from about 30 to about 50.

D. Particulate Fillers

Particulate fillers, which are not generally conductive, may also beemployed in the polymer composition to help achieve the desiredproperties and/or color. When employed, such particulate fillerstypically constitute from about 5% by weight to about 40% by weight, insome embodiments from about 10% by weight to about 35% by weight, and insome embodiments, from about 10% by weight to about 30% by weight of thepolymer composition. Particulate clay minerals may be particularlysuitable for use in the present invention. Examples of such clayminerals include, for instance, talc (Mg₃Si₄O₁₀(OH)₂), halloysite(Al₂Si₂O₅(OH)₄), kaolinite (Al₂Si₂O₅(OH)₄), illite((K,H₃O)(Al,Mg,Fe)₂(Si,Al)₄O₁₀[(OH)₂,(H₂O)]), montmorillonite(Na,Ca)_(0.33)(Al,Mg)₂Si₄O₁₀(OH)₂.nH₂O), vermiculite((MgFe,Al)₃(Al,Si)₄O₁₀(OH)₂.4H₂O), palygorskite((Mg,Al)₂Si₄O₁₀(OH).4(H₂O)), pyrophyllite (Al₂Si₄O₁₀(OH)₂), etc., aswell as combinations thereof. In lieu of, or in addition to, clayminerals, still other particulate fillers may also be employed. Forexample, other suitable particulate silicate fillers may also beemployed, such as mica, diatomaceous earth, and so forth. Mica, forinstance, may be a particularly suitable mineral for use in the presentinvention. As used herein, the term “mica” is meant to genericallyinclude any of these species, such as muscovite (KAl₂(AlSi₃)O₁₀(OH)₂),biotite (K(Mg,Fe)₃(AlSi₃)O₁₀(OH)₂), phlogopite (KMg₃(AlSi₃)O₁₀(OH)₂),lepidolite (K(Li,Al)₂₋₃(AlSi₃)O₁₀(OH)₂), glauconite(K,Na)(Al,Mg,Fe)₂(Si,Al)₄O₁₀(OH)₂), etc., as well as combinationsthereof.

E. Other Additives

Still other additives that can be included in the composition mayinclude, for instance, antimicrobials, pigments, antioxidants,stabilizers, surfactants, waxes, solid solvents, flame retardants,anti-drip additives, and other materials added to enhance properties andprocessability. Lubricants may also be employed in the polymercomposition that are capable of withstanding the processing conditionsof the liquid crystalline polymer without substantial decomposition.Examples of such lubricants include fatty acids esters, the saltsthereof, esters, fatty acid amides, organic phosphate esters, andhydrocarbon waxes of the type commonly used as lubricants in theprocessing of engineering plastic materials, including mixtures thereof.Suitable fatty acids typically have a backbone carbon chain of fromabout 12 to about 60 carbon atoms, such as myristic acid, palmitic acid,stearic acid, arachic acid, montanic acid, octadecinic acid, parinricacid, and so forth. Suitable esters include fatty acid esters, fattyalcohol esters, wax esters, glycerol esters, glycol esters and complexesters. Fatty acid amides include fatty primary amides, fatty secondaryamides, methylene and ethylene bisamides and alkanolamides such as, forexample, palmitic acid amide, stearic acid amide, oleic acid amide,N,N′-ethylenebisstearamide and so forth. Also suitable are the metalsalts of fatty acids such as calcium stearate, zinc stearate, magnesiumstearate, and so forth; hydrocarbon waxes, including paraffin waxes,polyolefin and oxidized polyolefin waxes, and microcrystalline waxes.Particularly suitable lubricants are acids, salts, or amides of stearicacid, such as pentaerythritol tetrastearate, calcium stearate, orN,N′-ethylenebisstearamide. When employed, the lubricant(s) typicallyconstitute from about 0.05 wt. % to about 1.5 wt. %, and in someembodiments, from about 0.1 wt. % to about 0.5 wt. % (by weight) of thepolymer composition.

III. Formation

The liquid crystalline polymer, mineral fibers, functional compound, andother optional additives may be melt processed or blended togetherwithin a temperature range of from about 250° C. to about 450° C., insome embodiments, from about 280° C. to about 400° C., and in someembodiments, from about 300° C. to about 380° C. to form the polymercomposition. For example, the components (e.g., liquid crystallinepolymer, mineral fibers, functional compound, etc.) may be suppliedseparately or in combination to an extruder that includes at least onescrew rotatably mounted and received within a barrel (e.g., cylindricalbarrel) and may define a feed section and a melting section locateddownstream from the feed section along the length of the screw.

The extruder may be a single screw or twin screw extruder. Referring toFIG. 3, for example, one embodiment of a single screw extruder 80 isshown that contains a housing or barrel 114 and a screw 120 rotatablydriven on one end by a suitable drive 124 (typically including a motorand gearbox). If desired, a twin-screw extruder may be employed thatcontains two separate screws. The configuration of the screw is notparticularly critical to the present invention and it may contain anynumber and/or orientation of threads and channels as is known in theart. As shown in FIG. 3, for example, the screw 120 contains a threadthat forms a generally helical channel radially extending around a coreof the screw 120. A hopper 40 is located adjacent to the drive 124 forsupplying the liquid crystalline polymer and/or other materials (e.g.,mineral fibers and/or functional compound) through an opening in thebarrel 114 to the feed section 132. Opposite the drive 124 is the outputend 144 of the extruder 80, where extruded plastic is output for furtherprocessing.

A feed section 132 and melt section 134 are defined along the length ofthe screw 120. The feed section 132 is the input portion of the barrel114 where the liquid crystalline polymer, mineral fibers, and/or thefunctional compound are added. The melt section 134 is the phase changesection in which the liquid crystalline polymer is changed from a solidto a liquid. While there is no precisely defined delineation of thesesections when the extruder is manufactured, it is well within theordinary skill of those in this art to reliably identify the feedsection 132 and the melt section 134 in which phase change from solid toliquid is occurring. Although not necessarily required, the extruder 80may also have a mixing section 136 that is located adjacent to theoutput end of the barrel 114 and downstream from the melting section134. If desired, one or more distributive and/or dispersive mixingelements may be employed within the mixing and/or melting sections ofthe extruder. Suitable distributive mixers for single screw extrudersmay include, for instance, Saxon, Dulmage, Cavity Transfer mixers, etc.Likewise, suitable dispersive mixers may include Blister ring,Leroy/Maddock, CRD mixers, etc. As is well known in the art, the mixingmay be further improved by using pins in the barrel that create afolding and reorientation of the polymer melt, such as those used inBuss Kneader extruders, Cavity Transfer mixers, and Vortex IntermeshingPin mixers.

The mineral fibers can be added to the hopper 40 or at a locationdownstream therefrom. In one particular embodiment, the mineral fibersmay be added a location downstream from the point at which the liquidcrystalline polymer is supplied. In this manner, the degree to which thelength of the microfibers is reduced can be minimized, which helpsmaintain the desired aspect ratio. If desired, the ratio of the length(“L”) to diameter (“D”) of the screw may be selected to achieve anoptimum balance between throughput and maintenance of the mineral fiberaspect ratio. The LID value may, for instance, range from about 15 toabout 50, in some embodiments from about 20 to about 45, and in someembodiments from about 25 to about 40. The length of the screw may, forinstance, range from about 0.1 to about 5 meters, in some embodimentsfrom about 0.4 to about 4 meters, and in some embodiments, from about0.5 to about 2 meters. The diameter of the screw may likewise be fromabout 5 to about 150 millimeters, in some embodiments from about 10 toabout 120 millimeters, and in some embodiments, from about 20 to about80 millimeters. The L/D ratio of the screw after the point at which themineral fibers are supplied may also be controlled within a certainrange. For example, the screw has a blending length (“L_(B)”) that isdefined from the point at which the fibers are supplied to the extruderto the end of the screw, the blending length being less than the totallength of the screw. The L_(B)/D ratio of the screw after the point atwhich the mineral fibers are supplied may, for instance, range fromabout 4 to about 20, in some embodiments from about 5 to about 15, andin some embodiments, from about 6 to about 10.

In addition to the length and diameter, other aspects of the extrudermay also be controlled. For example, the speed of the screw may beselected to achieve the desired residence time, shear rate, meltprocessing temperature, etc. For example, the screw speed may range fromabout 50 to about 800 revolutions per minute (“rpm”), in someembodiments from about 70 to about 150 rpm, and in some embodiments,from about 80 to about 120 rpm. The apparent shear rate during meltblending may also range from about 100 seconds⁻¹ to about 10,000seconds⁻¹, in some embodiments from about 500 seconds⁻¹ to about 5000seconds⁻¹, and in some embodiments, from about 800 seconds⁻¹ to about1200 seconds⁻¹. The apparent shear rate is equal to 4Q/πR³, where Q isthe volumetric flow rate (“m³/s”) of the polymer melt and R is theradius (“m”) of the capillary (e.g., extruder die) through which themelted polymer flows.

Regardless of the particular manner in which it is formed, the presentinventors have discovered that the resulting polymer composition canpossess excellent thermal properties. For example, as noted above, themelt viscosity of the polymer composition may be low enough so that itcan readily flow into the cavity of a mold having small dimensions. Thecomposition may nevertheless still exhibit a relatively high meltingtemperature. For example, the melting temperature of the polymer may befrom about 250° C. to about 400° C., in some embodiments from about 280°C. to about 395° C., and in some embodiments, from about 300° C. toabout 380° C.

IV. Molded Parts

Once formed, the polymer composition may be molded into a shaped partfor a variety of different applications. For example, the shaped partmay be molded using a one-component injection molding process in whichdried and preheated plastic granules are injected into the mold.Regardless of the molding technique employed, it has been discoveredthat the polymer composition of the present invention, which possessesthe unique combination of high flowability and good mechanicalproperties, is particularly well suited for electronic parts having asmall dimensional tolerance. Such parts, for example, generally containat least one micro-sized dimension (e.g., thickness, width, height,etc.), such as from about 500 micrometers or less, in some embodimentsfrom about 50 to about 450 micrometers, and in some embodiments, fromabout 100 to about 400 micrometers.

One such part is a fine pitch electrical connector. More particularly,such electrical connectors are often employed to detachably mount acentral processing unit (“CPU”) to a printed circuit board. Theconnector may contain insertion passageways that are configured toreceive contact pins. These passageways are defined by opposing walls,which may be formed from a thermoplastic resin. To help accomplish thedesired electrical performance, the pitch of these pins is generallysmall to accommodate a large number of contact pins required within agiven space. This, in turn, requires that the pitch of the pin insertionpassageways and the width of opposing walls that partition thosepassageways are also small. For example, the walls may have a width offrom about 500 micrometers or less, in some embodiments from about 50 toabout 450 micrometers, and in some embodiments, from about 100 to about400 micrometers. In the past, it has often been difficult to adequatelyfill a mold of such a thin width with a thermoplastic resin. Due to itsunique properties, however, the polymer composition of the presentinvention is particularly well suited to form the walls of a fine pitchconnector.

One particularly suitable fine pitch electrical connector is shown inFIG. 1. An electrical connector 200 is shown that a board-side portionC2 that can be mounted onto the surface of a circuit board P. Theconnector 200 may also include a wiring material-side portion C1structured to connect discrete wires 3 to the circuit board P by beingcoupled to the board-side connector C2. The board-side portion C2 mayinclude a first housing 10 that has a fitting recess 10 a into which thewiring material-side connector C1 is fitted and a configuration that isslim and long in the widthwise direction of the housing 10. The wiringmaterial-side portion C1 may likewise include a second housing 20 thatis slim and long in the widthwise direction of the housing 20. In thesecond housing 20, a plurality of terminal-receiving cavities 22 may beprovided in parallel in the widthwise direction so as to create atwo-tier array including upper and lower terminal-receiving cavities 22.A terminal 5, which is mounted to the distal end of a discrete wire 3,may be received within each of the terminal-receiving cavities 22. Ifdesired, locking portions 28 (engaging portions) may also be provided onthe housing 20 that correspond to a connection member (not shown) on theboard-side connector C2.

As discussed above, the interior walls of the first housing 10 and/orsecond housing 20 may have a relatively small width dimension, and canbe formed from the polymer composition of the present invention. Thewalls are, for example, shown in more detail in FIG. 2. As illustrated,insertion passageways or spaces 225 are defined between opposing walls224 that can accommodate contact pins. The walls 224 have a width “w”that is within the ranges noted above. As shown, the walls 224 may beformed from a polymer composition containing mineral fibers (e.g.,element 400). In addition to or in lieu of the walls, it should also beunderstood that any other portion of the housing may also be formed fromthe polymer composition of the present invention. For example, theconnector may also include a shield that encloses the housing. Some orall of the shield may be formed from the polymer composition of thepresent invention. For example, the housing and the shield can each be aone-piece structure unitarily molded from the polymer composition.Likewise, the shield can be a two-piece structure that includes a firstshell and a second shell, each of which may be formed from the polymercomposition of the present invention.

Of course, the polymer composition may also be used in a wide variety ofother components. For example, the polymer composition may be moldedinto a planar substrate for use in an electronic component. Thesubstrate may be thin, such as having a thickness of about 500micrometers or less, in some embodiments from about 50 to about 450micrometers, and in some embodiments, from about 100 to about 400micrometers. In one embodiment, for example, the planar substrate may beapplied with one or more conductive elements using a variety of knowntechniques (e.g., laser direct structuring, electroplating, etc.). Theconductive elements may serve a variety of different purposes. In oneembodiment, for example, the conductive elements form an integratedcircuit, such as those used in SIM cards. In another embodiment, theconductive elements form antennas of a variety of different types, suchas antennae with resonating elements that are formed from patch antennastructures, inverted-F antenna structures, closed and open slot antennastructures, loop antenna structures, monopoles, dipoles, planarinverted-F antenna structures, hybrids of these designs, etc. Theresulting antenna structures may be incorporated into the housing of arelatively compact portable electronic component, such as describedabove, in which the available interior space is relatively small.

One particularly suitable electronic component that includes an antennastructure is shown in FIGS. 4-5 is a handheld device 410 with cellulartelephone capabilities. As shown in FIG. 4, the device 410 may have ahousing 412 formed from plastic, metal, other suitable dielectricmaterials, other suitable conductive materials, or combinations of suchmaterials. A display 414 may be provided on a front surface of thedevice 410, such as a touch screen display. The device 410 may also havea speaker port 440 and other input-output ports. One or more buttons 438and other user input devices may be used to gather user input. As shownin FIG. 5, an antenna structure 426 is also provided on a rear surface442 of device 410, although it should be understood that the antennastructure can generally be positioned at any desired location of thedevice. As indicated above, the antenna structure 426 may contain aplanar substrate that is formed from the polymer composition of thepresent invention. The antenna structure may be electrically connectedto other components within the electronic device using any of a varietyof known techniques. For example, the housing 412 or a part of housing412 may serve as a conductive ground plane for the antenna structure426.

A planar substrate that is formed form the polymer composition of thepresent invention may also be employed in other applications. Forexample, in one embodiment, the planar substrate may be used to form abase of a compact camera module (“CCM”), which is commonly employed inwireless communication devices (e.g., cellular phone). Referring toFIGS. 6-7, for example, one particular embodiment of a compact cameramodule 500 is shown in more detail. As shown, the compact camera module500 contains a lens assembly 504 that overlies a base 506. The base 506,in turn, overlies an optional main board 508. Due to their relativelythin nature, the base 506 and/or main board 508 are particularly suitedto be formed from the polymer composition of the present invention asdescribed above. The lens assembly 504 may have any of a variety ofconfigurations as is known in the art, and may include fixed focus-typelenses and/or auto focus-type lenses. In one embodiment, for example,the lens assembly 504 is in the form of a hollow barrel that houseslenses 604, which are in communication with an image sensor 602positioned on the main board 508 and controlled by a circuit 601. Thebarrel may have any of a variety of shapes, such as rectangular,cylindrical, etc. In certain embodiments, the barrel may also be formedfrom the polymer composition of the present invention and have a wallthickness within the ranges noted above. It should be understood thatother parts of the camera module may also be formed from the polymercomposition of the present invention. For example, as shown, a polymerfilm 510 (e.g., polyester film) and/or thermal insulating cap 502 maycover the lens assembly 504. In some embodiments, the film 510 and/orcap 502 may also be formed from the polymer composition of the presentinvention.

Yet other possible electronic components that may employ the polymercomposition include, for instance, cellular telephones, laptopcomputers, small portable computers (e.g., ultraportable computers,netbook computers, and tablet computers), wrist-watch devices, pendantdevices, headphone and earpiece devices, media players with wirelesscommunications capabilities, handheld computers (also sometimes calledpersonal digital assistants), remote controllers, global positioningsystem (GPS) devices, handheld gaming devices, battery covers, speakers,camera modules, integrated circuits (e.g., SIM cards), housings forelectronic devices, electrical controls, circuit breakers, switches,power electronics, printer parts, etc.

Regardless of the particular application in which it is employed, themolded part can possess excellent mechanical and thermal properties. Thepart may, for instance, possess a Charpy notched impact strength greaterthan about 3 kJ/m², greater than about 4 kJ/m², in some embodiments fromabout 5 to about 40 kJ/m², and in some embodiments, from about 6 toabout 30 kJ/m², measured at 23° C. according to ISO Test No. 179-1)(technically equivalent to ASTM D256, Method B). The tensile andflexural mechanical properties are also good. For example, the part mayexhibit a tensile strength of from about 20 to about 500 MPa, in someembodiments from about 50 to about 400 MPa, and in some embodiments,from about 100 to about 350 MPa; a tensile break strain of about 0.5% ormore, in some embodiments from about 0.6% to about 10%, and in someembodiments, from about 0.8% to about 3.5%; and/or a tensile modulus offrom about 5,000 MPa to about 20,000 MPa, in some embodiments from about8,000 MPa to about 20,000 MPa, and in some embodiments, from about10,000 MPa to about 15,000 MPa. The tensile properties may be determinedin accordance with ISO Test No. 527 (technically equivalent to ASTMD638) at 23° C. The part may also exhibit a flexural strength of fromabout 20 to about 500 MPa, in some embodiments from about 50 to about400 MPa, and in some embodiments, from about 100 to about 350 MPa; aflexural break strain of about 0.5% or more, in some embodiments fromabout 0.6% to about 10%, and in some embodiments, from about 0.8% toabout 3.5%; and/or a flexural modulus of from about 5,000 MPa to about20,000 MPa, in some embodiments from about 8,000 MPa to about 20,000MPa, and in some embodiments, from about 10,000 MPa to about 15,000 MPa.The flexural properties may be determined in accordance with ISO TestNo. 178 (technically equivalent to ASTM D790) at 23° C. The molded partmay also exhibit a deflection temperature under load (DTUL) of about200° C. or more, and in some embodiments, from about 200° C. to about280° C., as measured according to ASTM D648-07 (technically equivalentto ISO Test No. 75-2) at a specified load of 1.8 MPa.

In addition, the molded part can also have excellent antistaticbehavior, particularly when a conductive filler is included within thepolymer composition. Such antistatic behavior can be characterized by arelatively low surface and/or volume resistivity as determined inaccordance with IEC 60093. For example, the molded part may exhibit asurface resistivity of about 1×10¹⁵ ohms or less, in some embodimentsabout 1×10¹⁴ ohms or less, in some embodiments from about 1×10¹⁰ ohms toabout 9×10¹³ ohms, and in some embodiments, from about 1×10¹¹ to about1×10¹³ ohms. Likewise, the molded part may also exhibit a volumeresistivity of about 1×10¹⁵ ohm-m or less, in some embodiments fromabout 1×10¹⁰ ohm-m to about 9×10¹⁴ ohm-m, and in some embodiments, fromabout 1×10¹¹ to about 5×10¹⁴ ohm-m. Of course, such antistatic behavioris by no means required. For example, in some embodiments, the moldedpart may exhibit a relatively high surface resistivity, such as about1×10¹⁵ ohms or more, in some embodiments about 1×10¹⁶ ohms or more, insome embodiments from about 1×10¹⁷ ohms to about 9×10³⁰ ohms, and insome embodiments, from about 1×10¹⁸ to about 1×10²⁶ ohms.

The composition may also possess improved flame resistance performance,even in the absence of conventional flame retardants. The flameresistance of the composition may, for instance, be determined inaccordance the procedure of Underwriter's Laboratory Bulletin 94entitled “Tests for Flammability of Plastic Materials, UL94”. Severalratings can be applied based on the time to extinguish (total flametime) and ability to resist dripping as described in more detail below.According to this procedure, for example, a molded part formed from thecomposition of the present invention may achieve a V0 rating, whichmeans that the part has a total flame time of about 50 seconds or less,determined at a given part thickness (e.g., 0.25 mm or 0.8 mm). Toachieve a V0 rating, the part may also have a total number of drips ofburning particles that ignite cotton of 0. For example, when exposed toan open flame, a molded part formed from the composition of the presentinvention may exhibit a total flame time of about 50 seconds or less, insome embodiments about 45 seconds or less, and in some embodiments, fromabout 1 to about 40 seconds. Furthermore, the total number of drips ofburning particles produced during the UL94 test may be 3 or less, insome embodiments 2 or less, and in some embodiments, 1 or less (e.g.,0). Such testing may be performed after conditioning for 48 hours at 23°C. and 50% relative humidity.

The molded part may also possess a relatively high degree of heatresistance. For example, the molded part may possess a “blister freetemperature” of about 240° C. or greater, in some embodiments about 250°C. or greater, in some embodiments from about 260° C. to about 320° C.,and in some embodiments, from about 270° C. to about 300° C. Asexplained in more detail below, the “blister free temperature” is themaximum temperature at which a molded part does not exhibit blisteringwhen placed in a heated silicone oil bath. Such blisters generally formwhen the vapor pressure of trapped moisture exceeds the strength of thepart, thereby leading to delamination and surface defects.

The present invention may be better understood with reference to thefollowing examples.

Test Methods

Melt Viscosity:

The melt viscosity (Pa-s) may be determined in accordance with ISO TestNo. 11443 at a shear rate of 1000 s⁻¹ and temperature 15° C. above themelting temperature (e.g., 350° C.) using a Dynisco LCR7001 capillaryrheometer. The rheometer orifice (die) had a diameter of 1 mm, length of20 mm, L/D ratio of 20.1, and an entrance angle of 180°. The diameter ofthe barrel was 9.55 mm+0.005 mm and the length of the rod was 233.4 mm.

Melting Temperature:

The melting temperature (“Tm”) was determined by differential scanningcalorimetry (“DSC”) as is known in the art. The melting temperature isthe differential scanning calorimetry (DSC) peak melt temperature asdetermined by ISO Test No. 11357. Under the DSC procedure, samples wereheated and cooled at 20° C. per minute as stated in ISO Standard 10350using DSC measurements conducted on a TA Q2000 Instrument.

Deflection Temperature Under Load (“DTUL”):

The deflection under load temperature was determined in accordance withISO Test No. 75-2 (technically equivalent to ASTM D648-07). Moreparticularly, a test strip sample having a length of 80 mm, thickness of10 mm, and width of 4 mm was subjected to an edgewise three-pointbending test in which the specified load (maximum outer fibers stress)was 1.8 Megapascals. The specimen was lowered into a silicone oil bathwhere the temperature is raised at 2° C. per minute until it deflects0.25 mm (0.32 mm for ISO Test No. 75-2).

Tensile Modulus, Tensile Stress, and Tensile Elongation:

Tensile properties are tested according to ISO Test No. 527 (technicallyequivalent to ASTM D638). Modulus and strength measurements are made onthe same test strip sample having a length of 80 mm, thickness of 10 mm,and width of 4 mm. The testing temperature is 23° C., and the testingspeeds are 1 or 5 mm/min.

Flexural Modulus, Flexural Stress, and Flexural Strain:

Flexural properties are tested according to ISO Test No. 178(technically equivalent to ASTM D790). This test is performed on a 64 mmsupport span. Tests are run on the center portions of uncut ISO 3167multi-purpose bars. The testing temperature is 23° C. and the testingspeed is 2 mm/min.

Notched Charpy Impact Strength:

Notched Charpy properties are tested according to ISO Test No. ISO179-1) (technically equivalent to ASTM D256, Method B). This test is runusing a Type A notch (0.25 mm base radius) and Type 1 specimen size(length of 80 mm, width of 10 mm, and thickness of 4 mm). Specimens arecut from the center of a multi-purpose bar using a single tooth millingmachine. The testing temperature is 23° C.

Weldline Strength:

The weldline strength may be determined by first forming an injectionmolded line grid array (“LGA”) connector (size of 49 mm×39 mm×1 mm) froma polymer composition sample as is well known in the art. Once formed,the LGA connector may be placed on a sample holder. The center of theconnector may be subjected to a tensile force by a rod moving at a speedof 5.08 millimeters per minute. The peak stress may be recorded as anestimate of the weldline strength.

Blister Free Temperature:

To test blister resistance, a 127×12.7×0.8 mm test bar is molded at 5°C. to 10° C. higher than the melting temperature of the polymer resin,as determined by DSC. Ten (10) bars are immersed in a silicone oil at agiven temperature for 3 minutes, subsequently removed, cooled to ambientconditions, and then inspected for blisters (i.e., surface deformations)that may have formed. The test temperature of the silicone oil begins at250° C. and is increased at 10° C. increments until a blister isobserved on one or more of the test bars. The “blister free temperature”for a tested material is defined as the highest temperature at which allten (10) bars tested exhibit no blisters. A higher blister freetemperature suggests a higher degree of heat resistance.

UL94:

A specimen is supported in a vertical position and a flame is applied tothe bottom of the specimen. The flame is applied for ten (10) secondsand then removed until flaming stops, at which time the flame isreapplied for another ten (10) seconds and then removed. Two (2) sets offive (5) specimens are tested. The sample size is a length of 125 mm,width of 13 mm, and thickness of 0.8 mm. The two sets are conditionedbefore and after aging. For unaged testing, each thickness is testedafter conditioning for 48 hours at 23° C. and 50% relative humidity. Foraged testing, five (5) samples of each thickness are tested afterconditioning for 7 days at 70° C.

Vertical Ratings Requirements V-0 Specimens must not burn with flamingcombustion for more than 10 seconds after either test flame application.Total flaming combustion time must not exceed 50 seconds for each set of5 specimens. Specimens must not burn with flaming or glowing combustionup to the specimen holding clamp. Specimens must not drip flamingparticles that ignite the cotton. No specimen can have glowingcombustion remain for longer than 30 seconds after removal of the testflame. V-1 Specimens must not burn with flaming combustion for more than30 seconds after either test flame application. Total flaming combustiontime must not exceed 250 seconds for each set of 5 specimens. Specimensmust not burn with flaming or glowing combustion up to the specimenholding clamp. Specimens must not drip flaming particles that ignite thecotton. No specimen can have glowing combustion remain for longer than60 seconds after removal of the test flame. V-2 Specimens must not burnwith flaming combustion for more than 30 seconds after either test flameapplication. Total flaming combustion time must not exceed 250 secondsfor each set of 5 specimens. Specimens must not burn with flaming orglowing combustion up to the specimen holding clamp. Specimens can dripflaming particles that ignite the cotton. No specimen can have glowingcombustion remain for longer than 60 seconds after removal of the testflame.

Example 1

Samples 1-5 are formed from various percentages of a liquid crystallinepolymer, wollastonite (Nyglos® 4W or 8), anhydrous calcium sulfate,lubricant (Glycolube™ P), conductive filler, and black colormasterbatch, as indicated in Table 1 below. The black color masterbatchcontains 80 wt. % liquid crystalline polymer and 20 wt. % carbon black.In Samples 1-5, the conductive filler includes carbon fibers. In Sample6, the conductive filler also includes graphite. Finally, in Sample 7,the conductive filler is an ionic liquid—i.e., tri-n-butylmethylammoniumbis(trifluoromethanesulfonyl)-imide (FC-4400 from 3M). The liquidcrystalline polymer in each of the samples is formed from HBA, HNA, TA,BP, and APAP, such as described in U.S. Pat. No. 5,508,374 to Lee, etal. A comparative sample (Comp. Sample 1) is also formed withoutwollastonite. Compounding is performed using an 18-mm single screwextruder. Parts are injection molded the samples into plaques (60 mm×60mm).

TABLE 1 Comp. Sample Sample Sample Sample Sample Sample Sample Sample 11 2 3 4 5 6 7 LCP (wt. %) 47.2 77.2 67.2 57.2 67.2 37.2 56.4 36.4 GlassPowder 10.0 — — — — — — (wt. %) Talc (wt. %) 30.0 — — — — — — —Lubricant  0.3  0.3  0.3  0.3  0.3  0.3  0.3  0.3 (wt. %) Vectra ® A625— — — — — 30.0 — 20.0 FC-4400 — — — — — —  0.8  0.8 Black Color 12.512.5 12.5 12.5 12.5 12.5 12.5 12.5 Masterbatch Nyglos ® 4W — 10.0 20.030.0 — 20.0 10.0 30.0 Nyglos ® 8 — — — — 20.0 — — — Anhydrous — — — — —— 20.0 — Calcium Sulfate

Some of the molded parts are also tested for thermal and mechanicalproperties. The results are set forth below in Table 2.

TABLE 2 Sample 6 Sample 7 Melt Viscosity at 48.6 51.6 1000 s⁻¹ and 350°C. (Pa-s) Melt Viscosity at 78.5 78.6 400 s⁻¹ and 350° C. (Pa-s) Tm (°C.) 330.4 329.7 DTUL @ 1.8 Mpa (° C.) 212.4 215.7 Ten. Brk stress (MPa)117.63 81.8 Ten. Modulus (MPa) 9,249 8,842 Ten. Brk strain (%) 2.5 1.5Flex Brk stress (MPa) 114 105 Flex modulus (MPa) 8,518 9,344 Flex Brkstrain (%) 2.6 1.9 Charpy Notched (KJ/m²) 6.1 1.7

Example 2

Samples 8-9 are formed from various percentages of a liquid crystallinepolymer, wollastonite (Nyglos® 4W), lubricant (Glycolube™ P), mica,hydrated alumina (“ATH”), 4,4′-biphenol (“BP”), and2,6-naphthanlenedicarboxylic acid (“NDA”), as indicated in Table 3below. The liquid crystalline polymer in each of the samples is formedfrom 4-hydroxybenzoic acid (“HBA”), 2,6-hydroxynaphthoic acid (“HNA”),terephthalic acid (“TA”), and hydroquinone (“HQ”), such as described inU.S. Pat. No. 5,969,083 to Long, et al. NDA is employed in the polymerin an amount of 20 mol. %. Comparative samples (Comp, Samples 2 and 3)are also formed without wollastonite. Compounding is performed using an18-mm single screw extruder. Parts are injection molded the samples intoplaques (60 mm×60 mm).

TABLE 3 Comp. Comp. Sample 2 Sample 3 Sample 8 Sample 9 LCP (wt. %)67.57 67.57 67.57 67.57 Glass Powder (wt.) 10.00 10.00 — — Nyglos ® 4W —— 10.00 10.00 Mica (wt. %) 22.00 22.00 22.00 22.00 Lubricant (wt. %)0.10 0.10 0.10 0.10 Hydrated alumina 0.20 0.20 0.20 0.20 4,4′-biphenol0.10 0.10 0.10 0.10 2,6-naphthalene- 0.03 0.03 0.03 0.03 dicarboxy acid

Some of the molded parts are also tested for thermal and mechanicalproperties. The results are set forth below in Table 4.

TABLE 4 Comp. Comp. Sample 2 Sample 3 Sample 8 Sample 9 Melt Viscosityat 10 26 15 30 1000 s⁻¹ and 350° C. (Pa-s) Melt Viscosity at 13 34 22 41400 s⁻¹ and 350° C. (Pa-s) Tm (° C.) 340 316 339 318 DTUL @ 1.8 Mpa (°C.) 277 274 276 276 Charpy Notched (KJ/m²) 3.7 6.7 3.4 7.7 Ten. Brkstress (MPa) 118.4 136.5 114.0 138.1 Ten. Modulus (MPa) 14,280 12,45515,013 12,832 Ten. Brk strain (%) 1.4 2.97 1.1 2.46 Flex Brk stress(MPa) 159.52 175.52 158.31 180.69 Flex modulus (MPa) 14,786 12,93515,546 13,489 Flex Brk strain (%) 2.3 3.19 2.0 3.0 Weldline Strength(lbf) 6.6 8.2 6.0 8.0

Example 3

Sample 10 is formed from a liquid crystalline polymer, wollastonite(Nyglos® 4W), lubricant (Glycolube™ P), talc, hydrated alumina (“ATH”),4,4-biphenol (“BP”), 2,6-naphthanlenedicarboxylic acid (“NDA”), and ablack color masterbatch, as indicated in Table 5 below. The liquidcrystalline polymer in each of the samples is formed from4-hydroxybenzoic acid (“HBA”), 2,6-hydroxynaphthoic acid (“HNA”),terephthalic acid, and 4,4′-biphenol (“BP”). HNA is employed in thepolymer in an amount of 20 mol. %. Compounding is performed using an18-mm single screw extruder. Parts are injection molded the samples intoplaques (60 mm×60 mm).

TABLE 5 Sample 10 LCP (wt. %) 58.58 Nyglos ® 4W 18.00 Talc (wt. %) 18.00Lubricant (wt. %) 0.10 Hydrated alumina 0.20 4,4′-biphenol 0.102,6-naphthalenedicarboxy acid 0.03 Black Color Masterbatch 5.00

Molded parts are also tested for thermal and mechanical properties. Theresults are set forth below in Table 6.

TABLE 6 Sample 8 Melt Viscosity at 20.0 1000 s⁻¹ and 350° C. (Pa-s) MeltViscosity at 34.3 400 s⁻¹ and 350° C. (Pa-s) Tm (° C.) 343.79 DTUL @ 1.8Mpa (° C.) 274 Charpy Notched (KJ/m²) 2 Ten. Brk stress (MPa) 11 Ten.Modulus (MPa) 97 Ten. Brk strain (%) 8,254 Flex Brk stress (MPa) 2.02Flex modulus (MPa) 127 Flex Brk strain (%) 9,005 Weldline Strength (lbf)2.35

These and other modifications and variations of the present inventionmay be practiced by those of ordinary skill in the art, withoutdeparting from the spirit and scope of the present invention. Inaddition, it should be understood that aspects of the variousembodiments may be interchanged both in whole or in part. Furthermore,those of ordinary skill in the art will appreciate that the foregoingdescription is by way of example only, and is not intended to limit theinvention so further described in such appended claims.

What is claimed is:
 1. A polymer composition that comprises a functionalaromatic compound and plurality of mineral fibers embedded within athermotropic liquid crystalline polymer matrix, wherein the mineralfibers have a median width of from about 1 to about 35 micrometers andconstitute from about 5 wt. % to about 60 wt. % of the polymercomposition.
 2. The polymer composition of claim 1, wherein the liquidcrystalline polymer matrix constitutes from about 25 wt. % to about 95wt. % of the composition.
 3. The polymer composition of claim 1, whereinthe liquid crystalline polymer matrix includes a polymer that containsaromatic ester repeating units.
 4. The polymer composition of claim 3,wherein the aromatic ester repeating units are aromatic dicarboxylicacid repeating units, aromatic hydroxycarboxylic acid repeating units,aromatic diol repeating units, or a combination thereof.
 5. The polymercomposition of claim 3, wherein the polymer has a total amount ofrepeating units derived from naphthenic hydroxycarboxylic and/ornaphthenic dicarboxylic acids of more than about 10 mol. %.
 6. Thepolymer composition of claim 3, wherein the polymer contains repeatingunits derived from 4-hydroxybenzoic acid, terephthalic acid,hydroquinone, 4,4′-biphenol, 6-hydroxy-2-naphthoic acid, 2,6-naphthelenedicarboxylic acid, or a combination thereof.
 7. The polymer compositionof claim 1, wherein at least about 60% by volume of the mineral fibershave a diameter of from about 1 to about 35 micrometers.
 8. The polymercomposition of claim 1, wherein the mineral fibers have an aspect ratioof from about 1 to about
 50. 9. The polymer composition of claim 1,wherein the mineral fibers have a median width of from about 3 to about15 micrometers.
 10. The polymer composition of claim 1, wherein themineral fibers include fibers derived from a silicate.
 11. The polymercomposition of claim 10, wherein the silicate is an inosilicate.
 12. Thepolymer composition of claim 11, wherein the inosilicate includeswollastonite.
 13. The polymer composition of claim 1, wherein thefunctional aromatic compound has the general structure provided below inFormula (I):

or a metal salt thereof, wherein, ring B is a 6-membered aromatic ringwherein 1 to 3 ring carbon atoms are optionally replaced by nitrogen oroxygen, wherein each nitrogen is optionally oxidized, and wherein ring Bmay be optionally fused or linked to a 5- or 6-membered aryl,heteroaryl, cycloalkyl, or heterocyclyl; R₄ is OH or COOH; R₅ is acyl,acyloxy, acylamino, alkoxy, alkenyl, alkyl, amino, aryl, aryloxy,carboxyl, carboxyl ester, cycloalkyl, cycloalkyloxy, hydroxyl, halo,haloalkyl, heteroaryl, heteroaryloxy, heterocyclyl, or heterocycloxy; mis from 0 to 4; and n is from 1 to
 3. 14. The polymer composition ofclaim 1, wherein the functional aromatic compound includes a phenoliccompound, diphenolic compound, naphthenic compound, or a combinationthereof.
 15. The polymer composition of claim 1, wherein the functionalaromatic compound includes an aromatic diol.
 16. The polymer compositionof claim 15, wherein the aromatic diol is 4,4′-biphenol.
 17. The polymercomposition of claim 1, wherein the functional aromatic compoundincludes an aromatic carboxylic acid.
 18. The polymer composition ofclaim 17, wherein the aromatic carboxylic acid is 2,6-naphthelenedicarboxylic acid.
 19. The polymer composition of claim 1, whereinfunctional aromatic compounds constitute from about 0.001 wt. % to about5 wt. % of the polymer composition.
 20. The polymer composition of claim1, wherein the composition further includes at least one non-aromaticfunctional compound.
 21. The polymer composition of claim 20, whereinthe non-aromatic functional compound is a hydrate.
 22. The polymercomposition of claim 1, further comprising a conductive filler, glassfiller, clay mineral, or a combination thereof.
 23. The polymercomposition of claim 1, wherein the composition has a melt viscosity offrom about 0.1 to about 80 Pa-s, as determined in accordance with ISOTest No. 11443 at a shear rate of 1000 seconds⁻¹ and temperature that is15° C. above the melting temperature of the composition.
 24. Anelectrical connector comprising a molded part, the molded partcomprising the polymer composition of claim 1.